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ADP1043A
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage (Continuous) VDD
Digital Pins
Rating
4.2 V
?0.3 V to V DD + 0.3 V
THERMAL RESISTANCE
θ JA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
VS3? to PGND, AGND, DGND
RTD, VS1 to AGND
VS2, VS3+, ADD to AGND
?0.3 V to +0.3 V
2.5 V
?0.3 V to V DD + 0.3 V
Package Type
32-Lead LFCSP
θ JA
44.4
θ JC
6.4
Unit
°C/W
Operating Temperature Range
?40°C to +85°C
Storage Temperature Range
Junction Temperature
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
RoHS-Compliant Assemblies
(20 sec to 40 sec)
ESD Charged Device Model
ESD Human Body Model
?65°C to +150°C
150°C
240°C
260°C
1.5 kV
3.5 kV
SOLDERING
It is important to follow the correct guidelines when laying out
the PCB footprint for the ADP1043A and when soldering the
part onto the PCB. The AN-772 Application Note discusses this
topic in detail (see www.analog.com ).
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page 8 of 72
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